The HiLo socketing system can reduce development costs by allowing the same printed circuit board to be used for prototyping and production, thus cutting down on system development time. When every millimeter counts, the low-profile 2mm socket height enables low-profile prototypes since the board height, a critical constraint for handheld applications, remains at chip level.

For chip mounting using the HiLo system, the chip is attached to a pin field and a socket is soldered to the printed-circuit board. The pin field is then inserted into the socket. The pin field and socket combination accommodates multiple applications including production IC board mounting, board-to-board connection and other creative uses. The HiLo socket requires less insertion force per contact, supports high-speed applications, and is “pick and place” compatible.

“Success of consumer electronics products depends greatly on the adoption of new technology and the rate at which products are delivered to market,” said Brian Faith, Senior Director of Product Marketing. “In providing the HiLo socket system to designers of consumer applications, we help cut their development costs and speed time to market by allowing them to develop their system with the same printed circuit board as they intend to use for production, eliminating the need for board spins late in the design cycle.

The ISI HiLo sockets are available from ISI for as low as $93.00. For additional company or product information, please go to www.quicklogic.com or to www.isipkg.com

This news release contains forward-looking statements based on current expectations that involve risks and uncertainties. QuickLogic’s actual results may differ from the results described in the forward-looking statements. Factors that could cause actual results to differ include, but are not limited to, general conditions in the semiconductor industry, development risks, market acceptance and the impact of competitive products.

These and other risk factors are detailed in QuickLogic’s periodic reports and registration statements filed with the Securities and Exchange Commission.

QuickLogic Corporation (NASDAQ: QUIK) invented and has pioneered the Embedded Standard Product (ESP) architecture, with the introduction of first products in 1998. ESPs are semiconductor devices that

deliver the guaranteed performance, lower cost and lower risk of standard products, coupled with the flexibility and time-to-market benefits of programmable logic. QuickLogic's proprietary ViaLink metal-tometal interconnect technology offers significant benefits - including very low power at high performance levels - to our customers and is the foundation of our ESP product families, as well as our core FPGA products. Founded in 1988, the company is located at 1277 Orleans Drive, Sunnyvale, CA 94089-1138. For more information please visit the QuickLogic web site at www.quicklogic.com