ECOFRECTM TF 49 is a high viscosity tacky flux.
- Free of halide (Fluoride, Chloride, Bromide) and amine
- Non corrosive residue
- Complex blending of rosins, activators and solvents.
ECOFRECTM TF49 can be applied by dispensing, dipping, brush or stencil printing.
The tacky properties of ECOFRECTM TF49 ensure that components are kept in position until the alloy is
reflowed. A variety of reflow methods may be used to produce the solder joint with ECOFRECTM TF49 ;
these include soldering irons, hot gas and hot bar devices, IR or convection oven or vapour phase.
After soldering, the flux residue remaining of ECOFRECTM TF49 does not have to be removed by a cleaning
operation as it is chemically inert. However, if cleaning is required, the residue left after reflow can be easily
removed if needed with a large range of cleaning solutions, such as detergents, hydro-carbonated solvents or
halogenated solvents, all included in the INVENTEC cleaning range.
PACKAGING, STORAGE & SHELF LIFE
To ensure the best product performance, the recommended storage temperature range is room temperature.
For an optimal preservation, store cartridges and syringes in vertical position, tip downwards.
Use in well-ventilated areas. Safety glasses and gloves should always be worn when handling the flux.
No issues when used as recommended. Please refer to Material Safety Data Sheet before use.
INVENTEC Material Safety Data sheets can be found at www.quickfds.com